文档介绍：CMLT Ball Size & Gold Remain Issue - Smaller capillary CD ATS WB Process
Die source : Chi-Mei 14 x 17mil chip
Pad Opening : P Pad 94um, N Pad 92um
Bonding Method : BSOB 2 wires
Device : 3020 18 columns x 8 rows
Ball shear spec : > 42g
Ball size spec : Max 85um
Gold remain spec : > 50%
Gold Wire : K&S AW99 1mil (EL 2-7% BL >9g)
Capillary : GAISER 1551-13-437GM 65(6x120D-8D-10) (CD: () Tip: Hole:)
Material Background & Spec
P Pad
N Pad
Machine type : Harrier S/N TE019-052
Software version:
Machine Name : Harrier
System Version
rev 8
Site
Generic
PR
Rev 9
BQM
()
WH
Servo (Z)
Servo (XY)
Heater
30A
Bonder
Date/Time
Tue Jun 6 16:03:22 2006 ref:
Material Background
Parameter Setting
Scrub only applied to P Pad
Data
P Pad ball size & thickness
P Pad Bal