文档介绍：!"#$%&'()*+ VIAQADavid Huang Feb. 2001 E-Mail: David_******@.tw Page1of33 !"#$%&'()*+ 1 !IC "#$%&'()*+, 3~ 6 !(Chapter) "#(Page) 2 !IC -.&IC /012 7~ 9 3 !SMT 3.&PCBA 45(6 10~16 5 !BGARework 789: 19~22 6 !;<ESD/EOS =>?@ 23~31 7 !IC ABCD( FailureAnalysis) 32~33 4 !SMT EFGHIJKL 17~18 Page2of33 !"#$%&'()*+ IC IC "#$%&'()*+, "#$%&'()*+, 1-1. IC "#$%MN(ICDevicesIntroduction): ThroughHolePackage SurfaceMounted Package K BGA(Ball GridArray) FlipChip L Page3of33 !"#$%&'()*+ 1- '()*+,NO(Mechanical Specifications)P TheImportantSpecificationsforQFP: 1. LeadCo-planarity:USL:. 2. LeadSpan:USL:. 3. BentLead:USL:+3mils, LSL:-3mils. 4. QFPPackagewarpage:USL:4mils. 5. LQFPPackagewarpage:USL:3mils. <Note>(1)USL:UpperSpec. Limit. (2)LSL:LowerSpec. Limit. (3)1mil=. BentLeadSpec. VT82C586B YYWWRR TAIWAN LLLLLLLLL C M Y=DateCodeYear W=DateCodeWeek R=ChipRevision L=LotCode LeadCo-planaritySpec. Page4of33 !"#$%&'()*+ 1- '()*+,NO(Mechanical Specifications) : TheImportantSpecificationsforBGA: 1. SolderBallCo-planarity:USL= 2. Trueballpositionerror:USL=+, LSL=- :USL=35mils, LSL=24mils 4. Packagewarpage:USL= 5. SolderBallHeight:USL=28mils, LSL=19mils. <Note>(1)USL:UpperSpec. Limit. (2)LSL:LowerSpec. Limit. (3)1mil=. SolderBallCo-planarity SolderBall Height SolderBallDiameter Trueballposition error Y=DateCodeYear W=DateCodeWeek R=ChipRevision L=LotCode Page5of33 !"#$%&'()*+ ’’() ’’()* * BGASubstrate PCB/PWB SolderSphereCollapse Coplanarity issue arevirtually eliminatedwiththe finalcollapse **Thefinalheight will varywithpadsizeandsolderpastedeposition. Solder Ball Solder Ballscollapse duringreflow Canbe reflowedwith justflux Will selfcenter duringreflowprocess Nocleanflux mended PBGASolderBalls 1-4. TheStructureofSolderSpheretoSubstrate: 1-5. TransformationofBGASolderSphere inReflow: BT-RESIN PAD(Cu) Plating(Ni) Pl