文档介绍：FEA Modeling of a Wafer Level Seam Sealing Approach
for MEMS Packaging
Weidong Wang
Center for Ocean Technology, College of Marine Science, Univ. of South Florida
David Fries
Center for Ocean Technology, College of Marine Science, Univ. of South Florida

Abstract
A wafer level seam sealing process using resistive heating method is proposed in this paper. Using this
method, microelectromechanical (MEMS) devices can be capped and protected at wafer level before other
post packaging processes are performed. The sealing process can be done by localized resistive heating at
the contact areas between heating electrodes and the edges of the lid cover. A 3-D finite element analysis
(FEA) model was created to simulate the thermo-electric behavior of the proposed approach. Temperature
and electrical potential distributions were calculated using FEA. The simulation results indicated that this
method would provide a feasible solution for wafer level hermetic seam sealing for packaging MEMS
using locally heated eutectic bonding or soldering techniques. During the entire sealing processes, MEMS
devices will remain at the room temperature. Thus, thermal effect on MEMS devices from heating sources
can be minimized.
Introduction
One of the most important areas for developing mercializing MEMS is packaging [1, 2], since
packaging normally represents 50%~80% of the total costs of MEMS. So it is essential to develop some
low cost MEMS packaging technologies. One of the most challenging aspects regarding MEMS packaging
is that MEMS have moving parts, which differentiate their packaging requirements from standard
microelectronic packaging counter parts. The released moving parts are very delicate and very easy to be
damaged during packaging processes. For example, released MEMS parts simply can't go through dicing
process without using special tooling and care. It is not practical to release a huge amount of small MEMS
dies after d