01和申请材料一起寄出的cover letter-原稿.doc

文档介绍：和申请材料一起寄出信件
Beijing University
Beijing,100084
. CHINA
October 22, 1997
Dear Sir/Madam:
I wish to apply for and financial aids to your Graduate School to pursue a Master's degree in Materials Science and Engineering. My intended date of entry is Fall, 1998.
Enclosed please find: (1) pleted application form and application fee; (2) Official transcripts from Beijing University; (3) RESUME and PURPOSE STATEMENT; (4) Letters of mendation. Furthermore, I have requested the reference, I am enclosing photocopies of my TOEFL and GRE scores.
Thank you very much in advance for you immediate action to process my application.
Sincerely yours.