02和申请材料一起寄出的cover letter-改后稿.doc

文档介绍：和申请材料一起寄出的Cover Letter
Annie Wang
. Box 8740
Beijing 100084
. CHINA
October 22, 2001
Dear Sir / Madam:
I am applying for acceptance and financial aid in a bid to pursue a Master’s Degree in Materials Science and Engineering at your university. My intended date of enrollment is the beginning of September 2002.
Enclosed hereinwith are: (1) pleted application form; (2) the application fee by way of an international money order; (3) a copy of my resume, and (4) my personal statement.
The Beijing University, my alma mater, will send official transcripts of my undergraduate academic record to you soon. Meanwhile, I have arranged for you to receive three letters of mendation directly from their authors, two my former professors and the other my current employer.
I trust that you have rec