文档介绍：GET-BE-1001
Ver. :May, 2004
Pb-free Semiconductor Products
pound Semiconductor Devices, Ltd.
NCSD Pb-free Policies
Policies of pound Semiconductor Devices Ltd. (NCSD)
• We mitted to the global environment as a green vendor through
active Pb-free promotion of the development and supply of environment
friendly products.
• We have pleted the application of Pb-free
technology to all our products and are now receiving its Purchase Order.
• We will also address Pb-free in all our future products.
• We will not use different part numbers to Pb-free products, however, will
distinguish them from the existing products by their identification mark.
• We will phase out to Pb-free products with customer approval to
eventually fully abandon Pb* for protecting the environment.
*: As required by the RoHS Directive (note that materials containing Pb will still be used in some products). Please
contact our sales representatives for details.
Measures for Pb-free Implementation
1. Areas Requiring Pb-free Mount materials such as soldering
paste and soft solder.
(Modules and some power devices)
Solder Plating of Outer Leads
(Plastic packages)
2. Method of Pb-free Implementation
(1) Solder Plating for Outer Leads
Conventional Pb-free
Products Products
*
Sn-Pb Sn-Bi *Solder Dip: Sn-Ag-Cu Dip
Au Au
(2) Pb reduction inside the packages such as the mount materials
has already met the RoHS Directive requirements. (plete
Pb free technologies are currently under development. Its actual
implementation date is TBD).
Specification for Pb-free
Package Soldering of Outer Leads Mount Materials Pb Usage in Others
SOP Type Sn-Bi Plating Pb Not Used Pb Not Used
DIP Type Sn-Bi Plating Pb Not Used Pb Not Used
QFNType Sn-Bi Plating Pb Not Used Pb Not Used
MM Type Sn-Bi Plating Pb Not Used Pb Not Used
Complied with the RoHS
Complete Pb-free
Power Mold Sn-Bi Plating Implementation underway Pb Not Used
(Sn-Pb soft