SMT不良品控制.doc

文档介绍：工序操作所用设备及工具:
WT:
TO:[PE(SMT)(A)主管];[IE(A) MGR];
操作图示:
操作说明:
注意事项:
REVISION/AMENDMENT HISTORY
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DESCRIPTION
工序操作所用设备及工具:
WT:
TO: [PE(SMT)(A)主管];[IE(A) MGR];(SMT);(IPQC<SMT>)
(目标)
This procedure deals on how to control the defect rate on SMT line for both Pre and Post reflow Inspection, likewise this is to improve the feedback system wit
hin SMT line which is the main aim is to improve SMT quality level through better feedback loop using SPC tools.
此程序为了控制SMT炉前检查及炉后检查工序不良率而设定,同样为了完善SMT生产线的反馈系统,通过运用良好的反馈系统,采用SPC工具来改善SMT生产线的品质水平.
2. Details(详细资料)
Pre reflow-post reflow inspector (operator) 炉前检查作业员职责
List down defect found on PCB on “SMT pre and post reflow form (F-076)” as by number of ponent and number of defect board. On the same form, distinction on the per hourly defect quality should be made by having a vacant raw for each hour to distinguish hourly data.
以小时为单位,将检查出的不良状况分板数和元件数分别记录在“炉前炉后检查记录表”,以空白行将不同记录分开.
Tabulate the result by the number of ponent, record the quantity of defect on “SMT Defect Control Chart”.
将不良元件分类并将其数量记录在“SMT不良控制图表”中.
Control limit was pre-set on the “SMT Defect Control Chart”, if in case defect quantity is out of the control limit, ask cause analysis and corrective action from the production support.
在“SMT不良控制图表”预设控制线中,当不良数量超出控制线时通知技术员分析原因并作出改善.
Follow up the result of the corrective action by monitor