文档介绍：D116 Electrochemical and Solid-State Letters, 10 ͑10͒ D116-D119 ͑2007͒
1099-0062/2007/10͑10͒/D116/4/$ © The Electrochemical Society
Acceleration Effect of in Ag Electroplating
for Ultralarge-Scale Interconnects
Sung Ki Cho,a Jong Kyun Lee,a Soo-Kil Kim,b,* and Jae Jeong Kima,*,z
aResearch Center for Energy Conversion and Storage, School of Chemical and Biological Engineering,
Seoul National University, Kwanak-gu, Seoul 151-742, Korea
bCenter for Fuel Cell Research, Korea Institute of Science and Technology, Sungbuk-gu, Seoul 136-791,
Korea
The addition of accelerated the deposition rate in cyanide-based Ag electroplating. The catalytic effect came from the
high-plexation of Cu with the − ions in electrolyte. It changed the equilibrium state of the electrolyte, presented
͑͒−͑͒2−͑͒−
as an increase in the amount of pared to 3 . Because 2 could be reduced more easily, Ag electro-
͑͒−
plating was accelerated. Fourier transform infrared analysis showed the equilibrium change with the increase in 2 peak
according to the addition. For superfilling, it is necessary to localize plexation on the Cu surface.
© 2007 The Electrochemical Society. ͓DOI: All rights reserved.
Manuscript submitted May 17, 2007; revised manuscript received June 21, 2007. Available electronically August 3, 2007.
While Cu has been introduced essfully