文档介绍：摘要
科技的发展,生产电子线路板是当今社会主流行业之一。某电子厂从事镀铜电子线路板生产,它是通过电镀化学技术进行处理。当经过电镀化学药水置换、侵蚀等等反应,就形成——含铜废水。本课题从其来源种类、处理药物、处理条件等,以探究如何更有效的处理电镀含铜废水,最大限度减少废水中含铜量,最优的保护环境、绿色生产。本课题源于含铜废水处理是通过吸附、絮凝以及物理沉淀等进行处理的,因此从废水处理过程中温度、pH值、PAC、PAM等因素进行实验研究它们对除铜率的影响,通过对比探求最佳条件处理含铜废水。
关键词:电镀含铜废水吸附絮凝
Summary
The development of science and technology, the production electronics circuit plank is one of the social essential professions some electronics factory is engaged in to plate the copper electronics circuit plank production, it is to pass to electroplate a chemistry technique to carry on a has been electroplated the chemistry medicine water displacement and eroded etc. reaction, form-contain copper waste topic is from its source category, processing medicine, processing condition etc. with investigate how more effective processing electroplate to contain copper waste water, the biggest limit reduces to contain amount of copper in the waste water, and the superior environmental protection, green es from to contain a copper liquid waste processing is pass to adsorb, ulation and physics precipitates etc. carry on the processed, therefore the factors, such as temperature, pH, PAC and PAM...etc. starts experiment to study them from the liquid waste processing process to in addition to the copper leads of influence, investigate the best condition processing to contain copper waste water through a contrast.
Keyword: Electroplate to contain Copper waste Adsorb ulation
目录
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12
操作部分 12
14
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16
PH的影响 17
(PAM)的影响 18
(PAC)的影响 19
20
致谢 21
参考文献 22
电子线路板从发明至今,其历史60余年。历史表明:没有线路板,没有电子线路,飞行、交通、原子能、计算机、宇航、通信、家电……这一切都无法实现。道理是容易理解的,芯片、IC、集成电路是电子信息工业的粮食,半导体技术体现了一个,引导电子信息产业的发展。而半导体(集成电路、IC