文档介绍：第12卷第,期 3 期
Vo l . 1 2 , N o . 3

电子与封装装
ELECTRONICS & PACKAGING

总第107期
2012年3月
COB封装对LED光学性能影响的研究
祁姝琪1,丁申冬2,郑鹏1,秦会斌1
(,杭州 310018;
,浙江绍兴 312000)
摘要:针对LED高光效、低功耗的要求,文章在分析LED光学性能的基础上,采用了COB(Chip
On Board)即板上芯片封装技术。研究了不同封装工艺和材料,分析比较其对LED光通量、光效和
色温的影响。研究首先介绍COB封装的结构、优点及其实用性,然后分析影响LED光学性能的因素
,最后进行测试。在实验过程中,发现COB封装结构除了具有保护芯片的功能外,还可以提高出光
效率,并实现特定的光学分布。实验结果表明:文章提出的封装工艺对于提高光通量和光效、调节
色温有良好的效果。
关键词:COB;光学性能;LED
中图分类号:
文献标识码:A
文章编号:1681-1070(2012)03-0006-04
Research of the Effect on the LED Optical Performance from COB Packaging
QI Shu-qi1, DING Shen-dong2, ZHENG Peng1, QIN Hui-bin1
( of New Electron Device & Application, Hangzhou Dianzi University, Hangzhou 310018, China;
2. ZJGuYue LongShan Electronic Technology Development Co., Ltd., Shaoxing 312000, China)
Abstract: In this paper, the COB (Chip On Board) packaging technology is adopted in LED products
to meet the requirements of high efficiency and low power dissipation. The optical features of LEDs
are analyzed first. Subsequently, different packaging technology and materials are introduced to make a
comparison between each other's effects on the ﬂux, luminous efﬁciency and color temperature. Finally, the
COB packaging technology is presented. After the introduction of its structure, advantages and practical
utility, experiments are conducte