文档介绍：Developing
Mobile Applications
Borland®
®
VERSION 9 JBuilder
Borland Software Corporation
100 Enterprise Way, Scotts Valley, CA 95066-3249
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Printed in the .
JBE0090WW21003mobile 6E6R0503
0304050607-9 8 7654321
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Contents
Chapter 1 Emulator parameters . . . . . . . . . . . . 3-9
Introduction 1-1 Emulator device . . . . . . . . . . . . . . . 3-9
MIDlet parameters. . . . . . . . . . . . . . 3-9
Contents. . . . . . . . . . . . . . . . . . . . . . . 1-1
Build target . . . . . . . . . . . . . . . . . . 3-9
Resource links . . . . . . . . . . . . . . . . . . . 1-3
Documentation conventions . . . . . . . . . . . 1-4 Chapter 4
Developer support and resources . . . . . . . . 1-5
Contacting Borland Technical Support. . . . 1-5 Building MIDP applications 4-1
Online resources . . . . . . . . . . . . . . . . 1-piling . . . . . . . . . . . . . . . . . . . . . . 4-1
World Wide Web . . . . . . . . . . . . . . . . 1-6 Types piling . . . . . . . . . . . . . . . 4-1
Borland newsgroups . . . . . . . . . . . . . . 1-6 What can piled . . . . . . . . . . . . . 4-2
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