文档介绍：Electrochimica Acta 109 (2013) 226–232
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Electrochimica Acta
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An effective triblock copolymer as a suppressor for microvia filling via
copper electrodeposition
a a b a,∗ a c c,∗∗
Ning Xiao , Deyu Li , Guofeng Cui , Ning Li , Dong Tian , Qing Li , Gang Wu
a
Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China
b
School of Chemistry and Chemical Engineering, Sun Yat-sen University, Guangzhou 510275, China
c
Materials Physics and Applications Division, Los Alamos National Laboratory, Los Alamos, NM 87545, USA
a r t i c l e i n f o a b s t r a c t
Article history: In this work, an effective suppressor was found in copper electroplating solution for microvia filling. The
Received 14 April 2013
suppressor is a triblock prised of ethylene oxide (EO)–propylene oxide (PO)–ethylene
Received in revised form 16 July 2013
oxide (EO) with a molecular weight of 2900 (EPE 2900). In terms of the obtained filling performance
Accepted 16 July 2013
evaluated by observing the obtained cross-sectional views of the microvias after electroplating, the elec-
Available online xxx −
troplating solution was systematically studied as functions of Cl concentration, EPE 2900 concentration,
and convection conditi