文档介绍：Electrochimica Acta 116 (2014) 284–291
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Electrochimica Acta
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Adsorption behavior of triblock copolymer suppressors during
the copper electrodeposition
a a b a,∗ c c,1
Ning Xiao , Deyu Li , Guofeng Cui , Ning Li , Qing Li , Gang Wu
a
Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China
b
School of Chemistry and Chemical Engineering, Sun Yat-sen University, Guangzhou 510275, China
c
Materials Physics and Applications Division, Los Alamos National Laboratory, Los Alamos, NM 87545, United States
a r t i c l e i n f o a b s t r a c t
Article history: Suppressors play a significant role in microvia filling by copper electrodeposition to achieve electrical
Received 16 September 2013
interconnection of the adjacent layers in printed circuit boards (PCBs). In this work, in order to investi-
Received in revised form 3 November 2013
gate the adsorption behaviors of one type of triblock copolymer (with a structure of polyethylene oxide
Accepted 6 November 2013
- polypropylene oxide - polyethylene oxide and a molecular weight of 2900, named as EPE2900) on the
Available online 20 November 2013
cathode during the copper electroplating process, electrochemical methods such as cyclic voltammetric