文档介绍：Electrochimica Acta 70 (2012) 286–295
Contents lists available at SciVerse ScienceDirect
Electrochimica Acta
j ournal homepage: ate/electacta
Competitive anion/anion interactions on copper surfaces relevant for Damascene
electroplating
a a b b b c c a,b,∗
. Hai , . Huynh , A. Fluegel , M. Arnold , D. Mayer , W. Reckien , T. Bredow , P. Broekmann
a
Department of Chemistry and Biochemistry, University of Bern, Freiestr. 3, Bern, Switzerland
b
BASF SE, Global Business Unit Electronic Materials, 67056 Ludwigshafen, Germany
c
Mulliken Center for Theoretical Chemistry, University of Bonn, Beringstr. 4, 53115 Bonn, Germany
a r t i c l e i n f o a b s t r a c t
Article history: petitive interaction of chloride and SPS (bis-(sodium-sulfopropyl)-disulfide) at
Received 13 March 2012
Cu(1 0 0)/electrolyte model interfaces was studied by means of cyclic voltammetry bina-
Accepted 15 March 2012
tion with in situ STM and DFT. This specific anion/anion interaction is of paramount importance for
Available online 23 March 2012
the suppressor ensemble deactivation in the context of the industrial Cu Damascene process used
for the state-of-the-art on-chip metallization. It is the interplay between chemisorbed chloride and
Keywords:
SPS which regulates the dissociative SPS adsorption on copper as the key