文档介绍：Electrochimica Acta 70 (2012) 286–295
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Electrochimica Acta
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Competitive anion/anion interactions on copper surfaces relevant for Damascene
electroplating
a a b b b c c a,b,∗
. Hai , . Huynh , A. Fluegel , M. Arnold , D. Mayer , W. Reckien , T. Bredow , P. Broekmann
a
Department of Chemistry and Biochemistry, University of Bern, Freiestr. 3, Bern, Switzerland
b
BASF SE, Global Business Unit Electronic Materials, 67056 Ludwigshafen, Germany
c
Mulliken Center for Theoretical Chemistry, University of Bonn, Beringstr. 4, 53115 Bonn, Germany
a r t i c l e i n f o a b s t r a c t
Article history: petitive interaction of chloride and SPS (bis-(sodium-sulfopropyl)-disulfide) at
Received 13 March 2012
Cu(1 0 0)/electrolyte model interfaces was studied by means of cyclic voltammetry bina-
Accepted 15 March 2012
tion with in situ STM and DFT. This specific anion/anion interaction is of paramount importance for
Available online 23 March 2012
the suppressor ensemble deactivation in the context of the industrial Cu Damascene process used
for the state-of-the-art on-chip metallization. It is the interplay between chemisorbed chloride and
Keywords:
SPS which regulates the dissociative SPS adsorption on copper as the key step in the course of the
Copper Damascene process
surface-confined MPS (mercaptopropane sulfonic acid) production. The latter species is considered as
Electroplating
Additive the actual anti-suppressor (depolarizer) in context of the Cu Damascene process.
STM petitive conditions the chloride adsorbs and orders much faster on Cu(1 0 0) than the SPS. The
resulting c(2 × 2)-Cl adlayer acts as an effective barrier for the dissociative SPS adsorption, at least under
non-reactive conditions. Defect sites within the chloride matrix are identified as crucial pre-requisites f