文档介绍：内部公开▲印制电路板设计规范——工艺性要求(仅适用射频板)<本文中的所有信息均为***股份有限公司内部信息,不得向外传播。>内部公开▲Q/-2004目次前言………………………………………………………………………………………………II1范围...........................................................................................................................................12规范性引用文件.......................................................................................................................13术语和定义...............................................................................................................................14印制板基板...............................................................................................................................35PCB设计基本工艺要求............................................................................................................56拼板设计...................................................................................................................................67射频元器件的选用原则...........................................................................................................78射频板布局设计.......................................................................................................................79射频板布线设计.......................................................................................................................910射频PCB设计的EMC..............................................................................................................1411射频板ESD工艺.....................................................................................................................1812表面贴装元件的焊盘设计.....................................................................................................1913射频板阻焊层设计.................................................................................................................19附录A..............................................................................................................................................21附录B.......................................................