文档介绍：IC 封装设备切片机电控系统设计
宋佳丽
(长春税务学院计算机系吉林长春 130117)
摘要:为了高速、高精度切割半导体晶片,切片机的电控系统要求具备高精度及高稳定度。根据系统设计
指标和可编程控制器(PLC)的特点,选用日本 OMRON 公司的 CS1G 型 PLC 构成主控系统,FC10/400 型高
速电机及其配套变频器构成高速主轴系统,Y、Z 轴则用 PD-0535M 型步进电机驱动器驱动步进电机构成开
环控制系统,X 轴采用交流伺服电机及增量式编码器构成半闭环系统,θ轴选用美国 Parker 公司 DM1004B
型转台交流伺服电机及 DrvMⅡ型电机驱动器,供电系统采用隔离变压器等方法来屏蔽电磁干扰。通过多
模块运动控制软件协调控制,该系统完全达到了设计要求。
关键词:运动控制;可编程序控制器;集成电路封装;切片机
中图分类号:TP273+.5 文献标识码:B
Control system design of wafer incision device for IC encapsulation
SONG Jia-li
(Changchun College of Taxation, Changchun 130117, P. R. China)
Abstract: To incise apace and precisely semiconductor wafer, control system of wafer incision machine must be
also high-accuracy and high-stability. Based on design demand and characteristic of programmable logic
controller (PLC), a CS1G PLC of OMRON Corporation is selected for main system. A FC10/400 high speed
motor and its frequency-converter is selected for high speed rotation system, a PD-0535M stepper motor driver is
selected for Y and Z axis, and a AC servo motor is half closed looped by an incremental encoder for X axis. For θ
axis, a DM1004B AC servo motor and a DrvMⅡ driver of American Parker Corporation are selected, and the
ic interference of current supply system is shielded by a separate voltage changer. The system’
ic control software is design by means of multiple modular programming. So the system at