文档介绍：MAXIM专有产品型号命名                                       MAX  XXX  (X) X X X                                             1       2     3   4 5 6                   :MAXIM公司产品代号                   :                              三字母后缀:C=温度范围; P=封装类型; E=管脚数                              四字母后缀:B=指标等级或附带功能; C=温度范围; P=封装类型; I=管脚数                   :A表示5%的输出精度,E表示防静电                   :C=0℃至70℃(商业级)                                          I=-20℃至+85℃(工业级)                                          E=-40℃至+85℃(扩展工业级)                                          A=-40℃至+85℃(航空级)                                          M=-55℃至+125℃(军品级)                   : ASSOP(缩小外型封装)                          (塑料式引线芯片承载封装)                                        BCERQUAD                                      R窄体陶瓷双列直插封装(300mil)                                        CTO-220,TQFP(薄型四方扁平封装)        S小外型封装                                        D陶瓷铜顶封装                                   TTO5,TO-99,TO-100                                        E四分之一大的小外型封装                      UTSSOP,μMAX,SOT                                        F陶瓷扁平封装H模块封装,SBGA            W宽体小外型封装(300mil)                                        JCERDIP(陶瓷双列直插)                       XSC-70(3脚,5脚,6脚)                                        KTO-3塑料接脚栅格阵列                      Y窄体铜顶封装                                        (无引线芯片承载封装)                   ZTO-92MQUAD                                        MMQFP(公制四方扁平封装)                   / D裸片                                        N窄体塑封双列直插                              /PR增强型塑封                                        P塑封双列直插                                   /W晶圆                   :                                        A:8                                  J:32K:5,68                      S:4,80                                        B:10,64                          L:40                                  T:6,160                                        C:12,192