文档介绍：IPC-D-317A
Design Guidelines for
Electronic Packaging Utilizing
High-speed Techniques
A standard developed by the Institute for Interconnecting
and Packaging Electronic Circuits
COPYRIGHT Institute for Interconnecting & Packaging Electronic Circuits
Licensed by Information Handling Services
Notice IPC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitat-
ing interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for
his particular need. Existence of such Standards and Publications shall not
in any respect preclude any member or nonmember of IPC from manufacturing
or selling products not conforming to such Standards and Publication, nor
shall the existence of such Standards and Publications preclude their voluntary
use by those other than PC members, whether the standard is to be used
either domestically or internationally.
mended Standards and Publications are adopted by IPC without regard to
whether their adoption may involve patents on articles, materials, or processes.
By such action, IPC does not assume any liability to any patent owner, nor
do they assume any obligation whatever to parties adopting the mended
Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the IPC-D-317 Task Group
(D-21a) of the High Speed/High mittee (D-20) Institute for
Interconnecting and Packaging Electronic Circuits.
Q IPC 1995
Published January 1995
COPYRIGHT Institute for Interconnecting & Packaging Electronic Circuits
Licensed by Information Handling Services
***@PC IPC-D-317A
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