文档介绍：二、印制电路板(Printed Circuit Boards)
IPC-M-105 Rigid Printed Board Manual 刚性印制板设计手册
IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求
IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly印制板制造和组装的故障排除
IPC-6010 Series IPC-6010 Qualification and Performance SeriesIPC-6010印制电路板质量标准和性能规范系列手册
IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范
IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范(包括修改单1)
IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范
IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范(包括修改单1)
IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试
IPC-6015 Qualification & Performance Specification anic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范
IPC-A-600F Acceptability of Printed Boards 印制板验收条件
IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量评价
IPC-QE-605A-KIT Hard Copy and CD 印制板质量评价书和光盘(CD)
IPC-HM-860 Specification for Multilayer Hybrid Circuits多层混合电路规范
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards聚合物厚膜印制板的鉴定与性能
IPC-ML-960 Qualification and Performance Specification for Mass Lamination Pa