文档介绍：Interconnection Technology In Electronic Packaging
September 15,
Why? (Necessary--the purpose of the interconnection)
What? (Definition--bonding interconnection)
How? (Realization--methods used for the interconnection)
Where? (Application---fields )
Contents
Fundamentals of microjoining
Solid state bonding mechanism
Soldering and brazing mechanism
Fusion microjoining
Simulation
Techniques for microjoining and nanojoining
Wire bonding techniques in electronics
Solid state diffusion bonding
Soldering and brazing
Laser and electron beam microwelding
Resistance microwelding
Nanojoining
Materials cases and applications
– Shape memory alloy, superconductor, SOFC, ceramics, plastics
Applications of the interconnection tech.
MICROSYSTEMS
(Electronic Products, Photoelectrons, MEMS, etc.)
Communications
Consumer Electronics
Space Applications
Biomedical Applications
Hand-held Devices
Computers
Manufacturing process of electronic products
Silicon Wafer
IC Assembly
PCB Assembly
System Assembly
IC Packaging
System Packaging
Interconnection
Interconnection tech. in electronic packaging
Soldering
Wire Bonding
Applications of wire bonding
Challenges: Multi types of materials-used, complicated structures, flexible manufacturing, long-term reliability
ICs
LED
MEMS
Sensors
Structures of this course
Bonding Interconnection Technologies
Equipments
Materials
Quality
& Reliability
Characterization
& Mechanism
Application
& Trending
Fundamentals of Microjoining
Objectives and description
This course mainly introduces the research performances and new trend in the fields of microjoining and nanojoining these years, and the contents include the fundamental theories and practical applications of the microjoining.
Three parts are: fundamentals, techniques of microjoining and the microjoing of m