文档介绍：国防科学技术大学研究生院硕士学位论文
摘要
随着CMOS工艺的发展,单个芯片上集成的处理器的个数越来越多,传统的电
互连网络已经无法满足对互连网络性能的需求。同时基于电互连的片上网络NoC
在功耗、性能、带宽、延迟以及面积等方面遇到了发展瓶颈,需要一种新的互连
方式来解决。因此,光互连技术应运而生。光互连作为一种新的互连方式,具有
极低的功耗和巨大的带宽,可以解决电互连技术遇到的问题。应用光互连技术于
片上网络发展成为片上光网络技术,该技术具有低损耗、高吞吐率、低延迟等电
互连的片上网络无可比拟的优势。基于硅基技术的发展逐渐基本趋于成熟,硅基
高速电光调制器、硅基激光器和SiGe光电探测器等都取得了突破性进展。在单晶
硅上用VLSI技术集成光器件已经可行。
本文将对片上网络的光互连技术进行研究,包括芯片内部光互连网络技术和
芯片间光互连技术。文章首先从耦合模理论角度详细分析了光开关消光比及光强
传递函数,提出了3x3、4x4、5x5三种无阻塞光开关。并分析了基于光开关的片上
光网络相关拓扑结构、传输协议和路由算法等;其次,本文在电控制信号预约链
路,++和Pheonix仿真工具分析了网
络性能和功耗。同时改进了5x5光开关,优化其结构并分析其性能;实验结果表明,
本文中采用光开关的Torus在性能上要好于同等规模Mesh结构,在功耗方面要低于
同等规模电互连的片上网络。此外,本文对芯片间光互连技术光路耦合技术、微
形光路转向技术进行了研究,最终设计出了具有低损耗的微形光路转向元件和超
薄MT连接器。

主题词:片上光互连网络、片上网络、无阻塞光开关、性能分析、能耗分析、
芯片间光互连
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国防科学技术大学研究生院硕士学位论文
ABSTRACT
With the development of CMOS technologies, the number of processing cores that
are integrated into a chip multiprocessors (CMP) continues to grow. The traditional
electrical work cannot meet the demands on interconnection
networks work on-chip (NoC) encountered a bottleneck in power
consumption, performance, bandwidth, delay , area and requires a new way to solve it.
Therefore, the technology of optical interconnection is brought forward. Optical
interconnection is a new method of interconnention, which has many advantages such
as very low power consumption and huge bandwidth and can sovle the problems in
electrical optical interconnection into NoC as a optical
network on-chip(ONoC), which has parable advantages for low power
dissipation,high-throughput and low latency .At present,silicon-based technolgoy has
matured, high-speed silicon electro-optic modulator and silicon lasers and SiGe
photodetectors has made a optical devices using VLSI
technology on a silicon chip has been feasible.
This paper researchs optical interconnection in intra-chip and inter-chip. After
detailed analyzing the extinction ratio of optica