J-STD-033A_Handling_Packing_SMT Devices.pdf

文档介绍：IPC/JEDEC J-STD-033A
July 2002
Supersedes IPC/JEDEC J-STD-033
April 1999
JOINT
INDUSTRY
STANDARD
Handling, Packing,
Shipping and Use of
Moisture/Reflow
Sensitive Surface
Mount Devices
Notice EIA/JEDEC and IPC Standards and Publications are designed to serve the
public interest through eliminating misunderstandings between manufacturers
and purchasers, facilitating interchangeability and improvement of products,
and assisting the purchaser in selecting and obtaining with minimum delay
the proper product for his particular need. Existence of such Standards and
Publications shall not in any respect preclude any member or nonmember of
EIA/JEDEC or IPC from manufacturing or selling products not conforming
to such Standards and Publications, nor shall the existence of such Standards
and Publications preclude their voluntary use by those other than EIA/JEDEC
and IPC members, whether the standard is to be used either domestically or
internationally.
mended Standards and Publications are adopted by EIA/JEDEC and
IPC without regard to whether their adoption may involve patents on articles,
materials, or processes. By such action, EIA/JEDEC and IPC do not assume
any liability to any patent owner, nor do they assume any obligation whatever
to parties adopting the mended Standard or Publication. Users are also
wholly responsible for protecting themselves against all claims of liabilities for
patent infringement.
The material in this joint standard was developed by the EIA/JEDEC JC-
Committee on Reliability Test Methods for Packaged Devices and the IPC
Plastic Chip Carrier Cracking Task Group (B-10a)
For Technical Information Contact:
Electronic Industries Alliance/ IPC
JEDEC (Joint Electron Device 2215 Sanders Road
Engineering Council) Northbrook, IL 60062-6135
2500 Wilson Boulevard Phone [phone]
Arlington, VA 22201 Fax [phone]
Phone [phone]
Fax [phone]
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