文档介绍：IC PACKAGING PREPARED BY : SS SENG/24FEB2004 SEMICONDUCTOR MFG (BACK-END/PACKAGING) SMT PLASTIC PACKAGE : WAFER SAW/DICING DIE ATTACH/MOUNT WIRE BONDING MOLDING/ENCAPSULATION CROPPING/TRIM&FORM SOLDER DIPPING TESTING PACKING & SHIPPING PREPARED BY : SS SENG/24FEB2004 SEMICONDUCTOR MFG (BACK-END/PACKAGING) BGA : WAFER SAW/ DICING DIE ATTACH/ MOUNT WIRE BONDING MOLDING/ ENCAPSULATION SAWING SOLDER BALL ATTACH TESTING PACKING & SHIPPING PREPARED BY : SS SENG/24FEB2004 WAFER SAW/DICING PREPARED BY : SS SENG/24FEB2004 WAFER SAW/DICING Singulation of individual die : Mounting tape & frame Saw blades Washing Tape Curing PREPARED BY : SS SENG/24FEB2004 DIE ATTACH/MOUNT PREPARED BY : SS SENG/24FEB2004 DIE ATTACH/MOUNT Attach die to leadframe/substrate : Epoxy glue dispensing unto leadframe Die attach Epoxy glue curing PREPARED BY : SS SENG/24FEB2004 WIRE BONDING PREPARED BY : SS SENG/24FEB2004