文档介绍：BGA Solder Reflow and
Rework mendations
BGA Reflow Soldering mendations BGA Rework mendations
Reflow: Removal and replacement of BGA packages on printed
• Use caution when profiling to insure minimal tem- circuit boards is fairly straightforward. However, reat-
perature difference (<15°C and preferably <10°C) tachment or touch-up of BGA packages that have already
ponents been soldered to the board is not practical in most cases.
• Forced convection reflow with nitrogen preferred Three important criteria should be considered when
(50 – 75 PPM) choosing a rework system:
• Preheat stage temperature ramp rate: <2°C per • Minimize the change in temperature across the
second solder joint array to promote good solder joint forma-
• Time required in Flux Activation stage: 150 to 180 tion, minimize intermetallic growth, improve
seconds solderability and ponent warpage
• Flux Activation stage temperature range: 150 to • Minimize die temperature to prevent die delamina-
183°C tion and wire bond failure
• Time required in Solder stage: 60 seconds • Minimize board temperature adjacent to the rework
site to reduce intermetallic growth, prevent second-
• Maximum temperature 210 - 220°C (Do not exceed
ary reflow, and prevent ponent
10 seconds at maximum temperature)
delamination
• Cool-Down stage temperature reduction rate: <2°C
per second Refer to Ap