文档介绍：第 40 卷第 5 期电子科技大学学报
2011年9月 Journal of University of Electronic Science and Technology of China Sep. 2011
·机械电子工程·
多产品半柔性并联生产线预防性维修调度模型研究
李波,吴志明,王强
(电子科技大学空天科学技术研究院成都 611731)

【摘要】针对半导体芯片封装测试工厂多产品和半柔性并联生产线的预防性维修调度问题,提出了以生产时间最大化为
目标函数,以多产品情况下生产线柔性限度、各产品所需的生产时间要求、预防性维修宽放区间、维修班组数量为约束的多
产品半柔性并联生产线预防性维修调度的模型。将该模型应用于某芯片封装测试工厂的多产品半柔性并联生产线的预防性维
修调度,。调度结果已成功运用于实际生产,验证了该模型的可行性和准确性。
关键词封装测试工厂; 多产品; 并联生产线; 预防性维修; 调度; 半柔性
中图分类号 TP305 文献标识码 A doi:.1001-

Research on Preventive Maintenance Scheduling Model for
Multi-Products and Semi-Flexible Parallel Production Line

LI Bo, WU Zhi-ming, and WANG Qiang
(Institute of Astronautics & Aeronautics, University of Electronic Science and Technology of China Chengdu 611731)

Abstract According to preventative maintenance scheduling for Multi-products and Semi-flexible Parallel
Production Line (MSPPL) in semiconductor chipset assembly and test factories, the preventive maintenance
scheduling model for MSPPL is proposed with the maximal production time as the objective function and under
four constraints semi-flexible limits, multi-product production time requirements, preventive maintenance time
windows, and the amount of preventive maintenance worker group. The proposed model has been applied in the
multi-products and semi-flexible pa