文档介绍：HDI Manufacturing Process Flow HDI Manufacturing Process Flow Pre-engineering Pattern imaging Etching Laminating Drilling Cu plating Hole plugging Pattern imaging Lamination Laser Ablation Mechanical drilling Pattern imaging Cu plating Solder Mask Surface Finished Routing Visual inspection Electric test Shipping Pre-engineering Pattern imaging Etching Laminating Drilling Desmear Cu plating Hole plugging Cu plating Belt Sanding Lamination Laser Ablation Mechanical drilling Cu plating Pattern imaging Solder Mask Gold plating Routing Electrical test Pattern imaging Hole counter Shipping Visual inspection * Raw material ( Thin Core,Copper,Prepreg …...) Raw Material : FR-4 (Difuntional,Tetrafuntional) Supplier : EMC ,Nan-Ya Sheet size : 36 ”*48”, 40 ”*48”,42 ”*48 Core Thickness : ”, ”, ”, ” ”, ”, ”, ” ”, ”, ”, ” Copper Foil : 1/3 oz,1/2 oz, oz,2 oz Prepreg type : 1080,2113,2116,1506,7628,7630 ( THIN CORE) Laminate Copper Foil 裁板(Panel Size) COPPER FOIL Epoxy Glass Photo Resist (壓膜) ( Dry Film Resist Coat) Etch Photoresist (D/F)