文档介绍：南京航空航天大学
硕士学位论文
大功率LED灯用敷铜陶瓷基板的制备及性能研究
姓名:俞晓东
申请学位级别:硕士
专业:材料学
指导教师:傅仁利
2011-03
南京航空航天大学硕士学位论文
摘要
本文采用厚膜印刷工艺,以含铜氧化物粉体为功能相,通过添加有机载体、无玻璃型粘结
相,制备了适合氧化铝陶瓷基板丝网印刷的电子浆料体系。随后通过烧结、还原和电镀工艺制
备出可用于大功率 LED 封装的敷铜陶瓷基板。采用 XRD 对敷铜基板试样物相结构进行分析,
利用扫描电子显微镜(SEM)及光学显微镜对制备试样的表面及界面微观结构进行观察,测试和
分析了基板的电学、力学和热学性能,利用 ANSYS 软件对敷铜陶瓷基板进行导热模拟和预测。
将敷铜陶瓷基板用于大功率 LED 封装结构中,对封装 LED 结构的结温及光衰等问题进行了初
步研究和评价。研究结果表明:1) 所研制的铜系电子浆料具有很好的稳定性及优良的流变性能,
丝网印刷图形精度高;2) 烧结过程中,界面处会产生新相 CuAlO2,其是提高敷铜陶瓷基板敷
接强度的主要原因;3) 在 600°C,N2/H2 气氛条件下还原铜层具有较低的表面电阻率,并为后
续致密化电镀工艺提供导电铜层;4) 通过电镀工艺可以制备敷接强度为 ,铜层厚
度为 60µm,热导率为 ·K 的敷铜陶瓷基板;5) 理论预测与实验结果对比,减小界面层
厚度是提高基板导热性能的主要途径,当界面层厚度为 3µm 时,所得基板敷接强度为 5kg/mm2,
热导率为 28 W/m×K。采用敷铜陶瓷基板封装的大功率 LED,在 20W 功率条件下引脚端温度仅
为 °C,最大光衰程度为 %,有效地提高了大功率 LED 的可靠性及寿命。
关键词:厚膜印刷工艺,电子浆料,敷铜陶瓷基板,敷接强度,热导率
I
大功率 LED 灯用敷铜陶瓷基板的制备及性能研究
Abstract
In this paper, thick film printing method was used. The optimized electronic slurry was chosen
by adding cuprous oxide power, organic carrier and no glass-based bonding phase. Followed by
sintering, reduction and plating process, the deposition of copper on ceramic substrate used in
high-power LED was prepared. The outer fired layers were analysed by X-ray diffraction (XRD). The
microstructure and morphology of reduced samples were examined by scanning electron microscopy
(SEM) and optical microscopy (OM). The electrical, mechanical and thermal performence were tested
and analysed. Subsequently, ANSYS was used for thermal simulation and prediction of substrate
models. Finally, the samples were used in high-power LED system, and its influence on junction
temperature and luminous flux degradation were studyed. Experimental results show: i) The optimum
slurry with the best electronic stability and good rheological properties was prepared by adding a
small amount of additives anic carrier with 57wt.% terpineol, .% butyl carbitol acetate,
.% dibutyl phthalate and 5wt.% ethyl cellulose. ii) Upo