文档介绍:
AlN/环氧树脂复合材料的制备及热性能的
研究#
牛瑞冬,晋普,金海云**
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(西安交通大学电气工程学院,西安 710049)
摘要:本文以纳米 AlN 粉体为填料,经偶联剂处理对纳米 AlN 粉体进行表面改性,制备出
AlN 填充的环氧复合材料。利用 SEM 观察对复合材料的显微组织进行了观察,同时测量了
该复合材料的热导率。实验结果表明,AlN/环氧复合材料的显微组织与单相环氧树脂有所不
同,它具有类似晶体的特性。AlN/环氧复合材料的类晶结构尺寸随着 AlN 含量的增加而减
小,但复合材料的热导率的随着 AlN 含量的增加而升高。实验表明含 40%质量分数 AlN 的
环氧树脂复合材料的热导率是单片环氧树脂热导率的 3 倍左右。
关键词:AlN;热导率;环氧树脂(EP);复合材料
中图分类号:
Research on Thermal Properties of AlN/ posites
NIU Ruidong, JIN Pu, JIN Haiyun
(School of Electrial Engineering, Xi'an Jiaotong University, Xi'an 710049)
Abstract: As the fillers, AlN powder was modified by coupling agent (KH-570), then the epoxy
composites filled with AlN powder were fabricated. The microstructure of the surface of
composites was observed by SEM. The thermal conductivity was also measured. The
experimental results showed that microstructure of posites filled with AlN powder was
different with monolithic epoxy. Some crystal-like characteristics could be observed. The grain
size of AlN/posites decreased with increasing AlN contents, and the thermal
conductivity posites increased with increasing AlN content. The thermal conductivity of
posites with 40wt. % AlN was about 3 times of monolithic epoxy.
Keywords: AlN; thermal conductivity; Epoxy(EP); composites
0 引言
近年来,随着电子设备的小型化、轻量化、高性能化,要求封装材料适应电子器件高集
成化、薄型化的发展;另外为了满足良好的绝缘性、耐热性、散热性和低膨胀系数等性能,
封装材料还必须具