文档介绍：（Suitable for teaching courseware and reports）
SOP封装工艺流程介绍
Contents
Package Instruction
Process Flow
Quality Control
Package Instruction
SOP
SSOP
3. TSSOP
4. MFP
ASE
ASE
Package Instruction
ASY process flow
Wafer Saw
Die Attach
Wire Bond
Wafer Mount
Wafer Grinding
Epoxy Cure
Molding
Post Mold Cure
Plating
Trim/Form
Packing & Shipping
De-junk
Laser Marking
前段制程
后段制程
Wafer
Die (chip)
Die on Lead frame
Epoxy
Lead Frame
Before
After
Laser Marking
Laser Marking
Laser Marking
Laser Marking
Wafer Grinding
LOAD
UNLOAD
GRINGING
Purpose:
Grinding the wafer to Customer required thickness
Wafer Grinding
晶圓 (未研磨)
研磨機
晶圓 (研磨後)
晶元背面Wafer backside
Frame
Mount Tape
Purpose:
Combine the wafer with Dicing tape onto the frame for die sawing
Wafer mount Machine
Wafer Mount
Frame
Purpose:
To separate dies from each other for die attach
Monitor
Load/Unload
Sawing
Cleaning
Machine
Wafer Saw
Before wafer saw:
After wafer saw:
Wafer Saw
Purpose:
Attach the dies with epoxy on substrate for the following
process
Die Attach
Output
Die bond
Substrate load bond