PB印制电路板PB工程问客.pdf

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PB PB工程问客印制电路olerance
8. Useless dimension
9. Add overshoot
XI. Packing
XII. Peelable solder mask
1. Peelable solder mask covered hole
2. Peelable solder mask plugged hole
3. Relax thickness for peelable solder mask
4. Without the detail dimension of peelable solder mask
XIII. Silkscreen
1. Marking in hole or pad
2. Marking in large solder surface
3. Legend on step area
XIV. Slot
1. Relax tolerance for non-plated slot
2. Relax tolerance for plated slot
XV. Solder mask
1. Add S/M Bridge for SMT
2. Change S/M plugged hole to covered hole
3. Hole size is too large to plug4. Hole size is too small to cover
5. Relax solder mask thickness
6. S/M cover gold finger
7. Solder mask material
8. Spacing is too narrow to add S/M Bridge
XVI. Solder thickness
Relax solder thickness
XVII. TAB
Without TAB on one row of units at the center
XVIII. Tg
Tg value is not specified for High Tg material
XIX. Trace
1. Connection between Cu grounds is too thin
2. Exposed trace from solder mask opening
3. Relax etching tolerance
4. Self-spacing
5. Spacing between two traces is too narrow
XX. Transfer board
Sample approval
XXI. V-Cut
1. Discontinuous V-Cut
2. Relax V-Cut remain thickness tolerance
3. Relax V-Cut groove angle tolerance
4. V-Cut remain thickness is too weak
5. V-Cut run across BAT
XXII. Warpage
Relax warpage
I. 板厚
1. 排板结构
2. 排板结构和板厚要求不一致
3. 释放板厚公差
II. 碳油
III. 铜厚& Pad
1. 为考虑二次钻孔的 NPTH 加 Cu clearance
2. 加 dummy pattern
3. 铜距板边太近
4. 铜延伸至单元边
5. 删除 NPTH 的 PAD
6. 相邻两 PAD 距离小于 4mil
7. 独立 Fiducial mark
8. 没有足够的空间来加大 PAD 以保证 2mil 焊锡圈9. Pad 尺寸太小
10. 有椭圆 PAD 的 PTH 孔
11. 释放孔壁铜厚
12. 释放外层铜厚
IV. D