文档介绍：Vol. 124, No. 3 TIN (IV) SENSITIZER 349
(1970); W. M. Latimer, "The Oxidation States of (1975). For a description of the mechanism, see
the Elements and their Potentials in Aqueous So- F. MSllers, H. J. Tolk, and R. Memming, ibid., 121,
lutions," Prentice Hall, New York (1952). 1160 (1974).
7. R. L. Meek, This Journal, 122, 1478 (1975). 9. S. L. Chow, N. E. Hedgecock, M. Schlesinger, and
8. J. J. Kelly and J. K. Vondeling, ibid., 122, 1103 J. Rezek, ibid., 119, 1013 (1972).
Effects in Eiectroless Copper Deposition
Milan Paunovic*'1
en Corporation, Photocircuits Division,
Research and Devetopment Laboratory, Gten Cove, New York 11542
ABSTRACT
The induction period and cathodic processes in electroless deposition of
copper have been studied by galvanostatic, chronopotentiometric, and po-
tential sweep methods. It is shown that the factors which determine the
duration of the induction period are the type and concentration of the ligand
that plexing the copper ions. The rate-determining factor is the rate of
establishment of the potential of the partial anodic process. Dissociation of a
plex preceding the charge transfer in the electrochemical and
electroless deposition of copper has been studied by chronopotentiometry and
potential sweep method. Chronopotentiometric i~1j2 -- ](i) and potential
sweep i/v '/~ ~- ](v)