文档介绍：Electrochemical and Solid-State Letters, 14 ͑1͒ D13-D15 ͑2011͒ D13
1099-0062/2010/14͑1͒/D13/3/$ © The Electrochemical Society
Through-Hole Filling by Copper Electroplating Using a Single
Organic Additive
Wei-Ping Dow,a,*,z De-Huei Liu,a Chun-Wei Lu,a Chien-Hung Chen,a
Jhih-Jyun Yan,a and Su-Mei Huangb
aDepartment of Chemical Engineering, National Chung Hsing University, Taichung 40227, Taiwan
bDepartment of Chemical Engineering, Army Academy, Jhong-Li, Tao-Yuan 32092, Taiwan
A copper electroplating process using a anic additive was developed for filling through holes of printed circuit boards.
anic additive acted as an inhibitor of copper deposition in the presence of chloride ions and H2SO4. This copper
electroplating formula resulted in center-up filling, which differs from the bottom-up filling exhibited by blind microvias. The
inhibiting strength of anic additive and the filling capability of the plating solution strongly depended on the concentration
of H2SO4. The electrochemical behavior of anic additive was characterized by electrochemical analyses and imaging of TH
cross sections.
© 2010 The Electrochemical Society. ͓DOI: All rights reserved.
Manuscript submitted September 11, 2010; revised manuscript received October 15, 2010. Published November 10, 2010.
Recently, the filling of micron-sized through holes ͑THs͒ by cop