文档介绍:微电路组装、三维立体组装(Microcircuit assembly, three-dimensional assembly)
Microcircuit assembly, three-dimensional assembly, university of Belgium
Microassembly technique
Micro packaging technology
Heat transfer from heat conduction, convection heat transfer and radiation heat transfer to the surrounding environment. Commonly used cooling method: natural cooling (including conduction, natural convection and radiation heat exchange cooling), forced air cooling and liquid cooling, evaporation cooling, thermoelectric refrigeration (semiconductor (cold) and heat pipe heat transfer, etc. The selection of cooling methods depends mainly on the heating power density of the element or equipment and the allowable temperature rise. The internal heat resistance can be reduced by improving the welding quality of each electrode inside ponents. Weizuzhuang Jishu micro assembly technology (micro packaging technol.,) in microelectronics technology, high density assembly technology and micro welding technology of prehensive is an assembly process technology, namely in a multilayer wiring substrate, according to the electrical schematic diagram, the microelectronic device and ponents assembled into a kind of technology of electronic hardware. It involves solid-state technology, membrane technology, thick film technology, micro circuit technology, interconnect and micro welding technology, heat, 798, micro control technology, high density assembly technology, testing technology, reliability puter aided engineering and other fields, is a gate, the structure, process, materials, components, etc are bined prehensive technology. The electronic assembly technology has experienced the following stages: the 40 years is the manual welding phase of the active device. When the transistor and printed circuit were introduced in the 1940s, and widely used in the 1950s and 60s, the process of manual welding was formed by the transistor and the printed circuit board. The assembly and structure of the elect