文档介绍：BGA REWORK
PARITIVE STUDY OF SELECTIVE SOLDER PASTE DEPOSITION
FOR AREA ARRAY PACKAGES
Ray Cirimele
BEST, Inc.
Rolling Meadows, Illinois
rcirimele@
ABSTRACT volume provided by the solder paste at a typical paste print
The rapid assimilation of Ball Grid Array (BGA) and other thickness is usually pared to the volume of
Area Array Package technology in the electronics industry solder provided by the eutectic solder balls and has little
is due to the fact that this package type allows for a greater effect on the joint characteristics.
I/O count in a smaller area while maintaining a pitch that
allows for ease of manufacture. While the original Regardless of the reliability claims for either solder paste or
assembly process has proven to be fairly trouble-free, paste flux, the use of solder paste can improve the yield of
replacement of Area Array package devices after the the BGA rework process. Coplanarity can be critical during
assembly process can be much more difficult. Many prefer the rework process. Many things can affect the coplanarity.
to use paste flux only during rework of Area Array devices, If the BGA has solder balls that are not coplanar it can result
there are still instances where selective solder paste in a “open connection”(a ball that has not contacted and
deposition is either required or highly beneficial. Just