文档介绍：华中科技大学
硕士学位论文
RFID封装中热压模块温度控制系统的设计与实现
姓名:李楠楠
申请学位级别:硕士
专业:机械电子工程
指导教师:尹周平
20070524
摘要
随着电子信息技术的迅速发展,无线射频识别(RFID)技术在物流等行业的广泛开
展,展现了电子标签的优良应用性能,使得人们对电子标签的推广应用翘首以待。但是,
电子标签制造装备的研发和生产工艺成为制约其低成本生产的瓶颈问题。
本文基于各向异性导电胶互连封装工艺,设计了一套用于 RFID(射频识别)电子
标签封装的固化模块的温度控制系统,并对温控系统进行了 PID 算法的闭环控制实验。
对比三种温度传感器(热电偶、铂电阻、热敏电阻)的性能,选择了适合本控制系
统的传感器—PT100,并对其进行了温度特性分析。针对传感器的非线性,提出两种校
正方案,分别给出两种方案存在的误差。最后得出高线性度的温度变送模块。
采用由表面测量内部温度点的方法,解决测量导电胶温度的问题。
根据控制要求,设计了可以同时控制 64 个热压头的温控方案。设计了单片机主电
路、驱动电路、存储器电路等原理图,并进行了 PCB 绘制和制作。
对被控对象进行系统辨识,采用 Matlab 软件进行仿真,得到 PID 控制的参数。并
用实验的方法进行验证和对比,最终得到合适的控制算法和参数,希望对后续设备的开
发和研究工作有参照作用。
最后对本论文的研究成果“RFID 封装设备热压模块温度控制系统”进行了总结,
同时提出了本系统存在的问题和下一步的工作方向。

关键词:电子封装热压温度控制 Pt100 线性化 PID 算法

I
Abstract
With the great development of electronic information technique, RFID technology is
widely expanded in many areas such as logistics trades. The expansion shows the excellent
properties of electronic tags, which makes people be on the tiptoe of expectation for the
spread use. At the same time, the R&D and manufacturing technology of electronic tags have
been the chokepoints that limit the decrease on the production cost.
Based on the Anisotropic Conductive adhesive Interconnect and Packaging Technology,
a set of temperature control system for RFID (radio frequency identification) tag packaging is
designed, as well as the PID algorithm experiment.
Based on paring of the properties of three temperature sensors (thermocouples,
platinum resistance, thermal resistance), PT100 is chosen for the control system. According to
its temperature property, two correction programs is proposed against the non-linear
characteristic. Errors of this two programs are given. Finally the high degree of linearity
temperature transmitter is got.
According to the control requirements, temperature control program that can control 64
bonders is designed. The MCU circuit, driving circuit and memory circuit diagram are
designed, and