文档介绍：umulation积累、ponent有源元Activedevice有源器件Activation激活Activationenergy激活能Activeregion有源(放大)区Admittance导纳Allowedband允带Alloyjunctiondevice合金结器件Aluminum(Aluminium)铝Aluminumoxide铝氧化物Aluminumpassivation铝钝化Ambipolar双极的Ambienttemperature环境温度Amorphous无定形的,非晶体的Amplifier功放、扩音器、poundsemiconductor二元化合物半导体Bipolar双极性的BipolarJunctionTransistor(BJT)双极晶体管BJT双极晶体管Bloch布洛赫Blockingband阻挡能带Blockingcontact阻挡接触Bodycentered体心立方Bodycentredcubicstructure体立心结构Boltzmann波尔兹曼Bond键、键合Bondingelectron价电子Bondingpad键合点Bootstrapcircuit自举电路Bootstrappedemitterfollower自举射极跟随器Boron硼Borosilicateglass硼硅玻璃Boundarycondition边界条件Boundelectron束缚电子Breadboard模拟板、实验板Breakdown击穿Breakover转折Brillouin布里渊Brillouinzone布里渊区Builtin内建的Buildinelectricfield内建电场Bulk体/bination体复合Burnin老化Burnout烧毁Buriedchannel埋沟Burieddiffusionregion隐埋扩散区Can外壳Capacitance电容Capturecrosssection俘获截面Capturecarrier俘获载流子Carrier载流子、载波Carrybit进位位Carryinbit进位输入Carryoutbit进位输出Cascade级联Case管壳Cathode阴极Center中心Ceramic陶瓷(的)Channel沟道Channelbreakdown沟道击穿Channelcurrent沟道电流Channeldoping沟道掺杂Channelshortening沟道缩短Channelwidth沟道宽度Characteristicimpedance特征阻抗Charge电荷、pensationeffects电荷补偿效应Chargeconservation电荷守恒Chargeneutralitycondition电中性条件Chargedrive电荷驱动Chargeexchange电荷交换Chargesharing电荷共享Chargetransfer电荷转移Chargestorage电荷存储Chemmicaletching化学腐蚀法ChemicallyPolish化学抛光ChemmicallyMechanicallyPolish(CMP)monmoderejectionratio(CMRR)plementaryMetalOxideSemiconductorFieldEffectTransistor(CMOS)puteraideddesign(CAD)puteraidedtest(CAT)puteraidedmanufacture(CAM)poundSemiconductor化合物半导体Conductance电导Conductionband导带Conductionbandedge导带底Conductionlevel导带态Conductionstate导带态Conductor导体Conductivity电导率Configuration组态Conlomb库仑ConpledConfigurationDevices结构组态Constants物理常数Constantenergysurface等能面Constantsourcediffusion恒定源扩散Contact接触Contamination治污Continuityequation连续性方程Contacthole接触孔Contactpotential接触电势Continuitycondition连续性条件