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电容失效分析.pdf

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电容失效分析.pdf

上传人:文库旗舰店 2022/6/21 文件大小:631 KB

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电容失效分析.pdf

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文档介绍:: .
MLCC Faiength Recommendation
About ‧f
or Keep ‧f /10Sec
About ‧f
(5) Resistance of PCB Substrate(Bending strength)
PCB Dimension: L90mm X W40mm
Material 楊氏係數 Equation Resistance of Bending Capacity (mm)
kg/mm2 t = t =
FR-2 730 X (/ t)2 4mm
FR-4 2,200 X () 2
Al2O3 Substrate 7,000 X () 2 Failure Mode Introduction - Mechanical Strength
Layout Design Suggesting for Bending
(1) Susceptibility to stress is in the order of : a>b>c≒d>e
e b
perforation slit
c
a d
(2) Handling after chip mounted
× o
Bending
TwistMLCC Failure Mode Introduction - Mechanical Strength
Layout Design Suggesting for Cutting
force
direct
force
1. Knife Management
2. Gap setting the edge of knife 10% of PCB thickness
× o slitMLCC Failure Mode Introduction - Mechanical Strength
ST Product Introduction
(1)The Principle
(a)Normal Product of Termination force
Bending
force
(b)ST Product of Termination
BendingMLCC Failure Mode Introduction - Mechanical