1 / 51
文档名称:

Study on Effective Thermal Conductivity of Copper Particle Filled Polymer Composites.pdf

格式:pdf   页数:51
下载后只包含 1 个 PDF 格式的文档,没有任何的图纸或源代码,查看文件列表

如果您已付费下载过本站文档,您可以点这里二次下载

Study on Effective Thermal Conductivity of Copper Particle Filled Polymer Composites.pdf

上传人:天龙八部 2012/9/30 文件大小:0 KB

下载得到文件列表

Study on Effective Thermal Conductivity of Copper Particle Filled Polymer Composites.pdf

文档介绍

文档介绍:Study on Effective Thermal Conductivity of
Copper Particle Filled posites


A Project Report Submitted in Partial Fulfillment of the Requirements for the Degree of


B. Tech.
(Mechanical Engineering)



By
KUNAL K SARAF
Roll No. 107ME008










Department of Mechanical Engineering
NATIONAL INSTITUTE OF TECHNOLOGY
ROURKELA
MAY, 2011
Study on Effective Thermal Conductivity of
Copper Particle Filled posites

A Project Report Submitted in Partial Fulfillment of the Requirements for the Degree of

B. Tech.
(Mechanical Engineering)



By
KUNAL K SARAF
Roll No. 107ME008



Under the supervision of
Dr. Alok Satapathy
Associate Professor
Department of Mechanical Engineering, NIT, Rourkela





Department of Mechanical Engineering
NATIONAL INSTITUTE OF TECHNOLOGY
ROURKELA
MAY, 2011
National Institute of Technology
Rourkela

C E R T I F I C A T E


This is to certify that the work in this thesis entitled Study on Effective Thermal
Conductivity of Copper Particle Filled posites by Kunal K Saraf,
has been carried out under my supervision in partial fulfillment of the
requirements for the degree of Bachelor of Technology in Mechanical
Engineering during session 2010 - 2011 in the Department of Mechanical
Engineering, National Institute of Technology, Rourkela.

To the best of my knowledge, this work has not been submitted to any other
University/Institute for the award of any degree or diploma.




Dr. Alok Satapathy
(Supervisor)
Associate Professor
Dept. of Mechanical Engineering
National Institute of Technology Rourkela – 769008
A C K N O W L E D G E M E N T


I would like to express my deep sense of gratitude and respect to my supervisor Prof.
ALOK SATAPATHY for his excellent guidance, suggestions and constant support. I consider
myself extremely lucky to be able to work und