文档介绍：Electrochimica Acta 89 (2013) 792–797
Contents lists available at SciVerse ScienceDirect
Electrochimica Acta
jou rnal homepage: ate/electacta
Electrodeposition of copper–tin film alloys for interconnect applications
a,∗ a a b a
Igor Volov , Xiaoxuan Sun , Greeshma Gadikota , Ping Shi , Alan C. West
a
Columbia University, Department of Chemical Engineering, New York, NY, USA
b
Atotech USA, Inc., Albany, NY, USA
a r t i c l e i n f o a b s t r a c t
Article history: The electrodeposition of copper–tin alloy thin films was studied as a potential application for on-
Received 21 July 2012
chip interconnection, where Cu–Sn alloys may be less susceptible to failure caused by electro- and
Received in revised form
stress-migration than pure copper. Alloys with variable Sn content were plated from acidic copper
21 November 2012
sulfate electrolytes by polarizing copper deposition into the region where Sn deposition became pos-
Accepted 22 November 2012
sible. The effective polarization was demonstrated by means of several halogen–polyether pairs, with
Available online 1 December 2012
Br–EPE (poly(ethylene glycol)-block-poly(propylene glycol)-block-poly(ethylene glycol)) pair exhibiting
the strongest polarization. Alloy content of Sn between 0 and 7 at% was obtained above the reduction
K