文档介绍：Electrochimica Acta 89 (2013) 537–548
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Electrochimica Acta
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On the role of halides and thiols in additive-assisted copper electroplating
a a a b b
Thi . Huynh , Florian Weiss , Nguyen . Hai , Werner Reckien , Thomas Bredow ,
c c c d a,c,∗
Alexander Fluegel , Marco Arnold , Dieter Mayer , Hubert Keller , Peter Broekmann
a
Department of Chemistry and Biochemistry, University of Bern, Freiestr. 3, 3012 Bern, Switzerland
b
Mulliken Center for Theoretical Chemistry, University of Bonn, Beringstr. 4, 53115 Bonn, Germany
c
BASF SE, Global Business Unit Electronic Materials, 67056 Ludwigshafen, Germany
d
Institute of Theoretical and Applied Physics, University of Stuttgart, Pfaffenwaldring 57, 70569 Stuttgart, Germany
a r t i c l e i n f o a b s t r a c t
Article history: The particular mechanistic role of halides in the additive-assisted copper electrodeposition is studied
Received 22 September 2012
by means bined potential/time transients, in situ STM (scanning tunneling microscopy) exper-
Received in revised form 30 October 2012
iments, DFT (density functional theory) calculations and ICP-MS (inductively coupled plasma mass
Accepted 30 October 2012
spectroscopy) analysis. More specifically, we studied petitive interaction of bromide and SPS
Available online 23 November 2012
(bis-sodium-sulfopropyl-disulfide). The latter additive monly used in the Damascene process as
specific antagonist (anti-suppressor, depolarizer) of the polyalkylene glycol (PAG) suppressor additives
Keywords:
whereas halides are essential co-additives of the suppressors.
Copper electrodeposition
Galvanostatic potential transient experiments indicate a substantial stabilization of the PAG suppressor
Plating additives
plexes at the copper/electrolyte interface under reaction conditions when the ch