文档介绍：2004-01-01IPC技术标准目录之EIPC-T-50FIPC-S-100IPC-E-500IPC-TM-650IPC-ESD-20-20IPC/EIAJ-STD-001CIPC-HDBK-001IPC-A-610CIPC-HDBK-610IPC-EA-100-KIPC/WHMA-A-620IPC/曰AJ-STD-012IPC-SM-784IPC/EIAJ-STD-026IPC技术标准目录之电子组装(Assembly)击:5523i子组装(Assembly)ircuits电子电路互连与封装的定义和术语StandardsandSpecificationsManual标准和详细说明汇编手册IPCElectronicDocumentCollection已出版的IPC标准电子交档资料合订本TestMethodsManual试验方法手册AssociationStandardfortheDevelopmentofanESDControlProgram静电释放控制过程(由静电释放协会制定)RequirementsforSolderedElectrical&ElectronicAssemblies电气与电子组装件锡焊要求HandbookandGuidetoSupplementJ-STD-001—IncludesAmendment1J-STD-eptabilityofElectronicAssemblies印制板组装件验收条件HandbookandGuidetoIPC-A-610(IncludesIPC-A-parisonIPC-610手册和指南(包括IPC-A-610B和C的对比)ElectronicAssemblyReferenceSet电子组装成套手册,包括:IPC/EIAJ-STD-001C,IPC-HDBK-001,IPC-A-610C。eptanceforCableandWireHarnessAssemblies电缆和引线贴装的要求和验收ImplementationofFlipChipandChipScaleTechnology倒装芯片及芯片级封装技术的应用GuidelinesforChip-on-BoardTechnologyImplementation芯片直装技术实施导则SemiconductorDesignStandardforFlipChipApplications倒装芯片用半导体设计标准J-STD-027IPC/EIAJ-STD-028SMC-WP-003J-STD-013IPC-7095IPC/EIAJ-STD-032IT-98000IT-98080IT-98093IPC-MC-790MechanicalOutlineStandardforFlipChipandChipSizeConfigurationsFC(倒装片)和CSP(芯片级封装)的外形轮廓标准PerformanceStandardforConstructionofFlipChipandChipScaleBumps倒装芯片及芯片级凸块结构的性能标准ChipMountingTechnology芯片贴装技术ImplementationofBallGridArrayandOtherHighDensityTechnology球栅阵列(BGA)及其它高密度封装技术的应用DesignandAssemblyProcessImplementationforBGAs球栅阵列的设计与-组装过程的实施PerformanceStandardforBallGridArrayBallsBGA球形凸点的标准规范JPLChipScalePackagingGuidelinesJPL发布的CSP导则注:IT(TheCaliforniaInstituteofTechnology)JPL(TheJetPropulsionLaboratory)JPLBallGridArrayPackagingGuidelinesJPL发布的BGA封装导则ITRIChipCarrier,Phase1ReportITRI关于芯片载体的报告ITRI(TheInterconnectTechnologyResearchInstitute)GuidelinesforMultichipModuleTechnologyUtilization多芯片组件技术应用导则IPC-M-108IPC-TP-1113IPC-CH-65AIPC-SC-60AIPC-SA-61IPC-AC-leanlinessMeasurement:WhatDoesItTellUs?电路板离子洁净度测量:它告诉我们什么?GuidelinesforCleaningofPrintedBoards&Assemblies印制板及组装件清洗导则PostSolderSolven